CAMERA MODULE

8MP IMX219 MIPI Interface M12 Fixed Focus Camera Module

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8MP IMX219 MIPI Interface M12 Fixed Focus Camera Module

HAMPO-KX8-IMX219 V3.0 is a 8Megapixel MIPI interface camera module, using diagonal 4.60mm (Type 1/4.0) CMOS active pixel type image sensor with a square pixel array and 8.08M effective pixels.

 

Support:  Trade, Wholesale

Factory Certifications:ISO9001/ISO14001

Product Certifications: CE/ROHS/FCC

QC Team: 50 members, 100% inspection before shipment

Custimized time: 7 days

Samples time: 3 days


Product Detail

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Product Tags

DVP High Resolution 8MP Sony IMX219 MIPI Interface M12 Fixed Focus Camera Module with Wide View of Angle Lens

Product Description
HAMPO-KX8-IMX219 V3.0 is a 8Megapixel MIPI interface camera module, using diagonal 4.60mm (Type 1/4.0) CMOS active pixel type image sensor with a square pixel array and 8.08M effective pixels. This chip operates with three power supplies, analogue 2.8V, digital 1.2 V, and IF 1.8 V, and has low power consumption.
High sensitivity, low dark current, and no smear are achieved through the adoption of R, G, and B primary color pigment mosaic filters. This chip features an electronic shutter with variable charge-storage time.
Specification
 Camera Module No.
HAMPO-KX8-IMX219 V3.0
Resolution
8MP
Image Sensor
IMX219
Sensor Size
1/4"
Pixel Size
1.12 um x 1.12 um
EFL
2.13 mm
F/No.
2.5
Pixel
3296 x 2480
View Angle
137.0°(DFOV) 111.0°(HFOV) 66.0°(VFOV)
Lens Dimensions
13.00 x 13.00 x 14.02 mm
Module Size
28.50 x 13.00 mm
Focusing
Fixed Focus
Interface
MIPI
 Lens Type
650nm IR Cut
Operating Temperature
-20°C to +60°C

Key Features

◆Back-illuminated CMOS image sensor Exmor RTM
◆2-wire serial communication circuit on chip
◆CSI2 serial data output (selection of 4lane/2lane)
◆Timing generator, H and V driver circuits on chip
◆CDS/PGA on chip
◆10-bit A/D converter on chip
◆Automatic optical black (OB) clamp circuit on chip
◆PLL on chip (rectangular wave)
◆High sensitivity, low dark current, no smear
◆Excellent anti-blooming characteristics
◆Variable-speed shutter function (1 H units)
◆R, G, B primary color pigment mosaic filters on chip
◆Max. 30frame/s in all-pixel scan mode
◆Pixel rate: 280 [Mpixel/s] (All-pixels mode)
◆180 frame/s @720p with 2x2 analog (special) binning, 60 frame/s @1080p with V-crop
◆Datarate: Max.755Mbps/lane (@4lane), 912Mbps/Lane(@2lane)
Applications

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  • HAMPO-KX8-IMX219 V3.0_00

    Here are Some Quick Links and Answers to Frequently Asked Questions.

    Check back for updates or contact us with your question.

     

    1. How to order?

    We will quote the price to customers after received their requests. After customers confirmed the specification, they will order samples for testing. After inspected all devices , it will be sent to the customer by express.

     

    2. Do you have any MOQ (minimum order)?

    Sample order will be supported.

     

    3. What is the payment terms?

    T/T bank transfer is accepted ,and 100% balance payment before goods shipment.

     

    4. What is your OEM requirement?

    You can choose multiple OEM services includes the pcb layout, update the firmware, color box design, change deceive name, logo label design and so on.

     

    5. How many years have you been established?

    We focus on the audio&video products industry over 8 years.

     

    6. How long is the warranty?

    We offer 1 year warranty to all of our products.

     

    7. How long is the delivery time?

    Normally the sample devices could be delivered within 7 working day , and the bulk order will depend on the quantity .

     

    8.What kind of software support I can get?

    Hampo provided lots of tailor-made rugged solutions to customers, and we can also provide SDK for some of projects, software online upgrade , etc.

     

    9.What kind of services can you provide?

    There is two services models for your option ,One is OEM service ,which is with customer’s brand based on our off-the-shelf products ;the other is ODM service according to the individual demands ,which included Appearance design ,structure design ,Mold development ,software and hardware development etc.

     

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